HK Mortgage Corporation Launches Retail Bond Issue
The HKMC also announced that it has signed an agreement with the Underwriting
Bank, HSBC for an underwriting amount of HKD300mn in respect of the 2-year
Hong Kong dollar notes of the Issue. Under the Programme, the HKMC has appointed 17 banks from the Dealer Group
as Placing Banks to distribute the Issue to retail investors. They are Bank
of China (Hong Kong), Bank of Communications Hong Kong Branch, Bank of East
Asia, China Construction Bank (Asia), Chiyu Bank, Chong Hing Bank, CITIC Ka
Wah Bank, Dah Sing Bank, DBS Bank (Hong Kong), Hang Seng Bank, HSBC, ICBC (Asia),
Nanyang Commercial Bank, Shanghai Commercial Bank, Standard Chartered Bank (Hong
Kong), Wing Hang Bank and Wing Lung Bank. The Placing Banks will also perform the role of market makers for the Issue
to facilitate transactions in the secondary market. This offering mechanism
through Placing Banks was first introduced by the HKMC in 2001, and has proven
highly effective in marketing bonds to retail investors. So far, the HKMC has
issued 10 retail bond issues totalling HKD13bn. HKMC retail bonds provide
investors with the choice of an additional investment product to achieve a balanced
investment portfolio and stable interest income. James H. Lau Jr., Chief Executive Officer of the HKMC, commented earlier this week that: "Today,
we are launching a new retail bond issue under the HKMC Retail Bond Programme,
which caters for investors who prefer stable interest income and also for more
experienced investors who look for yield enhancement and portfolio diversification.
I trust the HKMC's consistent efforts to promote the development of the retail
bond market will create a win-win situation for the investors, the placing banks
and the Corporation." The offer period commenced at 9am on 4th June 2008 and will end at 2pm
on 13th June 2008.
The Hong Kong
Mortgage Corporation Limited (HKMC) on Tuesday announced the launch of
a new retail bond issue with four series of notes under the HKD20bn
Retail Bond Issuance Programme.
09.06.2008

